Simplixity Technologies works at the intersection of electronics, semiconductor, and PCB engineering — helping customers verify the reliability and performance of components before they reach the field.
Our engineering approach centres on precise, repeatable test methodology: modular, configurable systems; continuous, high-sampling-rate monitoring; and statistical analysis that turns raw measurements into confident reliability predictions.
We work with organizations across defence, aerospace, and high-volume electronics manufacturing — environments where accuracy and repeatability are not optional.
Configurable, modular reliability test solutions covering package-level (PLR) and wafer-level (WLR) semiconductor reliability, built around independently operating application modules.
Compact, configurable systems built from independent test slots — combine application modules, Notebook Ovens, and DUT boards to match exact test requirements, with capacity to expand as needs grow.
VIEW DETAILSTest systems supporting both package-level reliability (PLR) with patented Notebook Ovens, and wafer-level reliability (WLR) via probe-card interfaces on thermal chucks.
VIEW DETAILSHigh-accuracy EM and SM application modules for interconnects — lines, vias, bumps, TSVs and pillars — from ultra-low-current precision through to high-current 3D IC testing.
VIEW DETAILSBTS, TDDB, SILC and MTTDB modules for dielectrics, barriers, and CMOS transistor gate oxides — including high-accuracy and multi-terminal variants for thin oxides, HKMG and FinFET.
VIEW DETAILSHCI and BTI (NBTI/PBTI) modules for CMOS and bipolar transistors, including advanced and high-voltage configurations for general-purpose and higher-voltage processes.
VIEW DETAILSFull-featured system software determines failure times from user-defined conditions, calculates acceleration model parameters, and predicts lifetimes with confidence intervals.
VIEW DETAILSEvery system is built on a framework of continuous monitoring, parallel measurement, and precision source-measurement circuitry — designed to characterize device behaviour in detail and capture breakdown events immediately.
Advanced engineering and simulation capabilities supporting critical industries and complex technical challenges.
Accurate source-measurement circuitry and independent application modules tuned to demanding test conditions.
Continuous, high-sampling monitoring designed to characterize behaviour in detail and catch breakdown events immediately.
Modular, scalable architecture that adapts system capacity and capability to exact customer requirements.
Package-level and wafer-level reliability testing, standard and custom DUT board designs, single- and multi-site interfaces.
Engineering guidance from requirement definition through configuration, testing, and results reporting.
Working alongside electronics, semiconductor, and PCB manufacturers to match systems to real production needs.
We work with your team to understand the testing requirement — devices, conditions, and reliability targets.
Application modules, Notebook Ovens, and DUT boards are matched and configured to the test requirement.
Controlled, precise testing runs with continuous, high-sampling monitoring across every DUT.
Measurement data is collected, stored, and analysed — including statistical lifetime and failure-time modelling.
Meaningful, engineering-grade results and reliability predictions are reported back to your team.
We work alongside electronics, semiconductor, and technology organizations that operate in demanding, high-reliability environments.
Talk to our engineering team about your testing, reliability, automation, or engineering requirements.
Share a few details about your testing or engineering requirement and our team will get back to you.